sodium hypophosphite
英
美
网络 次磷酸钠; 次磷酸钠盐; 次亚磷酸钠; 次磷酸纳; 食品添加剂次磷酸钠
双语例句
- The existing bath analyzing methods are compared, as a result a quick and continous method for determining sodium hypophosphite and stannum ( II) ion in electroless tin bath is determined.
并对现有的镀液分析方法进行了比较，确定了快速连续测定化学镀锡液中亚锡离子和次磷酸钠的方法。 - Studies on Cu-Ni alloy electroless plating using sodium hypophosphite as reductant;
选用次亚磷酸钠作还原剂，用化学镀的方法制备了铜镍合金化涤纶织物。 - Influence of Maleic Acid on the Deposition Behavior of Sodium Hypophosphite Electroless Copper Plating
马来酸对次磷酸钠化学镀铜沉积行为的影响 - Study on integrated utilization of by-products produced from industrial production of sodium hypophosphite
次磷酸钠工业生产副产物综合利用研究 - The Study of the Oscillation and Its Time Delay Control in Copper Anodic Dissolution in Phosphoric and Sulphuric Acid; Influence of Maleic Acid on the Deposition Behavior of Sodium Hypophosphite Electroless Copper Plating
磷酸&硫酸溶液中铜阳极电流振荡及其调控研究马来酸对次磷酸钠化学镀铜沉积行为的影响 - Ammonium molybdate and sodium hypophosphite are the chief formulation of coloring agent. Coloration after electroless Ni-P plating and color change after heat treatment are adopted.
发现钼酸铵和次亚磷酸钠可以作为着色液的主要成分，并确定了化学镀Ni-P后着色和着色后再进行热处理变色的二种工艺方法。 - Investigation of Sodium Hypophosphite Anodic Oxidizing Behavior in the Process of Acid Electroless Nickel Deposition
酸性化学镀镍中次亚磷酸钠阳极氧化行为的研究 - Based on catalyzing hypothesis of sodium hypophosphite, we explored and studied a non-phosphorus catalyst& sodium nitrilotriacetate.
依据次磷酸钠在体系中的催化作用开发和研究了无磷催化剂氨三乙酸钠。 - Catalysis of Sodium Hypophosphite on Citric Acid Finishing System
次磷酸钠在CA整理体系中的催化作用 - Research for the preparation of sodium hypophosphite and reaction kinetics
次磷酸钠制备及反应动力学研究 - The repid methods for determination of Ni~ ( 2+) and sodium hypophosphite concentrations in acidic and basic electroless Ni plating baths have been suggested based on the basic principle of linear sweep voltammetry and relative technique.
根据线性扫描伏安法的基本原理和有关的实验技术提出酸性和碱性化学镀镍液中Ni~（2+）和次磷酸钠浓度的快速测定法。 - Under the acidic and heating conditions, germanium dioxide reacts with sodium hypophosphite to give germanium chloroform.
在酸性条件下，二氧化锗与次亚磷酸钠经加热反应生成三氯甲锗烷，再与丙烯酸反应生成三氯代锗丙酸（中间体）。 - The relationships are studied by experiments between the depositional rate of nickel-phosphorus plating and the concentrations of nickel sulfate and sodium hypophosphite, the pH value, the category and dose of complexing agent of plating liquid.
本文着重讨论了影响镍磷化学镀镀层沉积速率的主要因素，研究了镀液中硫酸镍浓度、次亚磷酸钠浓度、pH值、络合剂浓度及络合剂种类与化学镀镀层沉积速率的关系。 - Experimental Study on the Preparation of Sodium hypophosphite from Phosphorus Sludge
泥磷制取次磷酸钠实验研究 - A process of electroless copper plating and its pretreatment of semiconductor N-silicon were introduced,( using) sodium hypophosphite as reducer and nickel sulfate as re-activation agent.
介绍了以次磷酸钠为还原剂、硫酸镍为再活化剂的半导体N型硅表面化学镀铜工艺及其前处理。 - Selection of compound initiating system composed of persulphate and reducing agent sodium thiosulfate is the characteristics of this synthesis, and final product with needed molecular weight was obtained by using sodium hypophosphite as a new type of chain transfer agent to replace traditionally used isopropyl alcohol.
该合成的特点是采用了过硫酸盐与还原剂硫代硫酸钠组成的复合引发剂体系，并且使用次磷酸钠作为新型链转移剂，代替了传统的异丙醇，最终得到所需分子量的产品。 - Catalytic effect of trace tin on decolorizing reaction of acid chrome blue K by reducing with sodium hypophosphite in dilute phosphate acid solution has been studied. Based on this study, a kinetic spectrophotometric method for the determination of trace tin has been established.
基于稀磷酸介质中痕量锡对次磷酸钠还原酸性铬蓝K褪色反应的催化作用，建立了测定痕量锡的动力学光度分析法。 - Sodium hypophosphite is used as reducing agent for electroless plating Ni-W-P and Ni-Co-P.
化学镀Ni-W-P、Ni-Co-P采用次磷酸钠作为还原剂。 - The primary characterstics for the process of electroless copper deposition, using sodium hypophosphite as reducing agent and nickel sulfate as re-activation agent, and the deposit structure were studied.
研究了以次磷酸钠为还原剂、硫酸镍为再活化剂的化学镀铜工艺和镀层结构，指出工艺的基本特性。 - Cobalt was deposited on spherical nickel hydroxide by electroless plating, using hydrazine or sodium hypophosphite as reductive agent and ammonia or potassium sodium tartrate as complexing agent, respectively.
采用水合联氨或次亚磷酸氢钠作还原剂，分别在酒石酸钾钠和氨的配合体系中镀覆球形氢氧化镍，对一定金属钴镀覆量下的产物进行了XRD和SEM分析与观测。 - The technique conditions of acidic chemical plating Ni-Sn-P alloy with high content of Stannum have been discussed in the presence of multi-ligands 、 stabilizer and brightener with sodium hypophosphite as reducing agent.
研究了在酸性条件下，以次亚磷酸钠为还原剂、多种配位剂共存、并有稳定剂和光亮剂存在条件下，镀层含锡量较高的化学镀Ni-Sn-P合金的工艺条件。 - The effects of concentration of nickel sulfate, sodium hypophosphite, sodium citrate, cupric sulfate, stabilizer and brightener, pH value and temperature on appearance, deposition rate and copper content in the obtained electroless deposits were studied.
研究了镀液中硫酸镍、次磷酸钠、柠檬酸钠、硫酸铜、稳定剂、光亮剂的含量以及pH值和温度等因素对合金镀层的外观、沉积速度及铜含量的影响。 - Voltammetric Determination of Ni~ ( 2+) and Sodium Hypophosphite Concentrations in Electroless Ni Plating Baths
伏安法测定化学镀镍液中Ni~（2+）和次磷酸钠浓度 - And the bottom-up electroless nickel filling was first achieved, using sodium hypophosphite as a reducing agent.
并且首次实现了在次磷酸钠作为还原剂的化学镀镍体系的超级化学镍填充。 - Using phosphorus sludge react with alkali solution to get sodium hypophosphite is an effective method.
泥磷与碱液反应制取次磷酸钠是一种有效回收单质磷的方法。 - The results showed that the Thiourea and Sodium acetate anhydrous concentration strongly affects the deposition rate and stability of the solution transformed and the following factors are Sodium hypophosphite, Lactic acid, Lead acetate and Nickel ion concentration in solution subsequently.
实验研究的结果显示，硫脲及无水乙酸钠浓度对转化镀液的沉积速度和稳定性都有显著的影响，影响作用次之的是次亚磷酸钠、乳酸、醋酸铅、镍离子的浓度。 - Sodium hypophosphite as an additive played a role of increasing nucleation and accelerating the initial deposition during electrodeposition.
次亚磷酸钠在石墨粉体电沉积铜过程中起诱导成核，加速初始沉积的作用。 - Sodium hypophosphite had the considerable economical value, was widely used in chemical plating, galvanization and so on.
次磷酸钠具有很高的经济附加值，广泛应用于化学镀、电镀等多个行业。